Heat Thermal Insulation Materials Thermal Gap Filler Cooling Electrical Heat Transfer Thermal Insulation Sheet
The TIS™109-05 Series products are the high-efficiency insulation ones with thermal conduction properties. The supplement of the insulation base film made by silica gel into the heat-conduction material creates a great effect on both the insulation and heat conduction.
TIS100-05 Series Datasheet-(E)-REV01.pdf
Features
> Highly compliant surface characteristic with high thermal conductivity
> High thermal conductive and high dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures
Applications
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
Typical Properties of TIS100-05 series | ||||
Product Name | TIS109-05 | TIS112-05 | TIS118-05 | Test Method |
Color | blue | Visual | ||
Construction &Compostion | Ceramic filled silicone elastomer / Fiberglass | ******* | ||
Composite Thickness | 0.23mm | 0.3mm | 0.45mm | ASTM D374 |
Hardness | 50 Shore 00 | ASTM D751 | ||
Specific Gravity | 1.72g/cc | ASTM D297 | ||
Tensile Strength | 425 Kpsi | ASTM D412 | ||
Continuous Use Temp | -45 to 180℃ | ******* | ||
Dielectric Breakdown Voltage | >3500 VAC | ASTM D149 | ||
Dielectric Constant | 5.5 MHz | ASTM D150 | ||
Volume Resistivity | 4.0X10¹³ Ohm-meter | ASTM D257 | ||
Flame Rating | 94 V0 | E331100 | ||
Thermal conductivity | 1.0 W/mK | ASTM D5470 |
Standard Thicknesses:
0.o09"(0.228mm),0.012"(0.304mm),0.018"(0.457mm)
Consult the factory alternate thickness.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on doule side with "A2" suffix.
Standard Sizes:
12" x 160(304mm x 48.76M)
lndividual die cut shapes can be supplied.
Company profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Independent R&D team
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