The TIA™600P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able toreplace the method of lubricating grease and mechanical fixing.

Features

> Thermal Conductivity: 0.8W/mK

> High performance,thermally conductive acrylic adhesive.

> Hihg bond strength to a variety of surfaces double sided pressure sensitive adhesive tape.

> Fire rating equate 94V0

Applications

> Mount heat sink onto BGA graphic processor or drive processor

> Mount heat spreader onto power converter PCB or onto motor control PCB

> High performance, thermally conductive acrylic adhesive

> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Standard Thicknesses:

0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)

Consult the factory alternate thickness.

Standard Sizes:

40" x 100'(1016mm x 30.48M) Individual die cut shapes can be supplied.

Reinforcement:

TIA™600P series The coil can be filled with PET.

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?