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High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Specifications
Brand Name :
Ziitek
Model Number :
TS-Ziitek-Sharp Metal X01
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bay
Name :
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Color :
Silvery white
Thermal Conductivity :
15.3~18.9W/mK
Composition :
Alloy
Temperature range :
-45℃～250℃
Density :
8.0g/cm³
Keywords :
Phase Changing Materials
Description

High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

TS-Ziitek-Sharp Metal x01 is a new type of alloy phase changing heat conduction product made from a mixture of several metals, designed to solve heat dissipation and reliability problems.


TS-ZiiteK-Sharp Metal X01 is not easy to evaporate, safe and non-toxic, stable in physical and chemical properties, and has high thermal conductivity etc.When the phase change temperature is higher than its phase change temperature,the phase change material begins to softening and phase change, and can be filled to the tiny irregular contact surface of the device.Form a very small contact thermal resistance interface, to achieve good heat.

Features


>Good thermal conductivity
>Non-toxic and environmentally safe

>Excellent long term stability
>Ensure low thermal resistance.


Applications


>Microprocessors

>Chipsets

>Graphic processing chips

>Set Top Box
>LED

Typical Properties of TS-Ziitek-Sharp Metal X01 Series
Property Value Test Method
Color Silvery white Visual
Composition Alloy ****
Density (g/cm³) 8.0 ASTM D792 @25℃
7.9 ASTM D792 @80℃
Thermal conductivity(W/mK) 18.9 ISO22007-2.2 @25℃
15.3 ISO22007-2.2 @80℃
Specific heat capacity(J/g℃) 0.24 ASTM E1269@25℃
0.26 ASTM E1269@80℃
Resistivity (Ω-m) ＜10-7 ASTM D257
Continuous Use Temp(℃) -45 to 250℃ Ziitek Test Method
Phase Change Temperature Range(℃) >60 ASTM D3418
Solidification Range(℃) ＜57 ASTM D3418

Storage Method
Recommended storage in a warehouse environment at 18-30°C, with maximum humidity notexceeding 70%.


Usage lnstructions
Avoid contact with aluminum or metal surfaces.
After applying X01, use a compatible thermal pad or foam to enclose and secure the area along the edges of the liquid metal, ensuring it remains contained without leaking or spreading.

High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

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High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

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Product Detail
Brand Name :
Ziitek
Model Number :
TS-Ziitek-Sharp Metal X01
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
negotiation
Contact Supplier
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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