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1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
Specifications
Brand Name :
ZIITEK
Model Number :
TIF™200-02E
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Products name :
1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
Construction & Compostion :
Ceramic filled silicone elastomer
Thermal conductivity :
1.25W/m-K
Hardness :
35 Shore 00
Thickness range :
2mm~5.0mm
Continuos Use Temp :
-45 to 200℃
Sample :
Sample free
Keywords :
Silicone Thermal Pad
Description

1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

The TIF™200-02E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink..

1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

Features

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating


Applications

> Monitoring the Power Box
> AD-DC Power Adapters
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF200-02E Series
Color Gray / White Visual
Construction Reinforcement Carrier Ceramic filled silicone elastomer **********
Thermal Conductivity 1.25 W/mK ASTM D5470
Hardness 35 Shore 00 ASTM 2240
Specific Gravity 2.2g/cc ASTM D297
Thickness range 0.020"-0.200" (0.5mm-5.0mm) ASTM D374
Dielectric Breakdown Voltage (T= 1mm above) >5500 VAC ASTM D149
Dielectric Constant 4.0MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Continuous Use Temp – 40 To 160 ℃ **********
Outgassing (TML) 0.35% ASTM E595
Flame Rating 94 V0 UL E331100

Product Thicknesses

0.010-inch to 0.200-inch(0.5mm to 5.0mm)

Product Sizes

8" x 16""(203mm x406mm)
lndividual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.


1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

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1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF™200-02E
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
1.25W/mK Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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