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Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components
Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components
Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components
Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components
Specifications
Brand Name :
ZIITEK
Model Number :
TIF700NUS
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Products name :
Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components
Hardness :
20 Shore 00
Color :
Gray
Specific Gravity :
3.5g/cc
Thickness :
0.020"(0.50mm)~0.200"(5.00mm)
Construction :
Ceramic filled silicone elastomer
Continuos Use Temp :
-45℃ to 200℃
Thermal conductivity& Compostion :
6.5W/m-K
Application :
Laptop CPU
Keywords :
Silicone Thermal Gap Filler
Description

Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components​

TIF®700NUS series of thermal interface materials is specficlly designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tighty to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling eficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency ofelectronic components, thereby enhancing operational stability and extending device lifespan.


Features:

> Excellent thermal conductivity: 6.5 Wm-K

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressureapplication environments
> Available in different thickness options


Applications:


> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED drivers and lamps

Typical Properties of TIF®700NUS Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.5g/cc ASTM D297
thickness 0.020"(0.50mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness＜1.0mm) 20 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >6000 VAC ASTM D149
Dielectric Constant

4.5MHz

 ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 6.5W/m-K ASTM D5470
Product Specification
Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components
Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

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Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF700NUS
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components
Silicone Thermal Conductive Laptop CPU Thermal Pad High Voltage Thermal Gap Filler For Electronic Components

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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