Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness Video from China

Thermal Gap Filler

Apr 21, 2025

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Product Description: Semiconductor automated test equipment (ATE) Ziitek Thermal Gap Filler in MB application TIF100-02S The TIF100-02S thermally conductive interface materials are applied to fill the air gaps between the ...learn more

Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness

Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness

10000/day

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Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier

10 Years

Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing 60 Shore 00

Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing 60 Shore 00

Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing 60 Shore 00

Large tolerance stack ups thermal conductive gap pad 50 Shore 00 for routers 3.0W silicone pads for gap filling

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Easily attached white thermal conductive pad TIF 100-20-06E 94 V0 2w/mK silicone heatsink pads for routers

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