CPU Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK Video from China

Thermal Gap Pad

Apr 10, 2025

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Product Description: CPU Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK The TIF100-30-05S thermally conductive interface materials are applied to fill the air gaps ...learn more

CPU Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK

CPU Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK

10000/day

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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10 Years

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