PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors Video from China

Thermal Adhesive Tape

Jan 02, 2025

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Product Description: Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors ...learn more

PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

1000SQM/Day

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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10 Years

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3W/mk Soft Compressible Thermal Conductive Pad for LED Heat Dissipation 2.75 g/cc Specific Gravity,45 Shore 00 hardness

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