Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc Video from China

Thermal Gap Pad

Apr 25, 2025

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Product Description: Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant The TIF™500S Series thermally conductive interface materials are applied to fill the air gaps between ...learn more

Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc

Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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10 Years

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