Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules Video from China

Thermal Gap Pad

Apr 21, 2025

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Product Description: China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction ...learn more

Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules

Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules

10000/day

negotiation

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Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier

10 Years

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3W/mk Soft Compressible Thermal Conductive Pad for LED Heat Dissipation 2.75 g/cc Specific Gravity,45 Shore 00 hardness

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Replace a batch

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