3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook Video from China

Thermal Gap Pad

Apr 10, 2025

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Product Description: 3.2 W/mK High Tack Surface Reduces Contact Resistance Thermal pad for Notebook The TIF1140-32-05US use a special process, with silicone as the base material, adding thermal conductive powder and ...learn more

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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