4.0 Mhz Moldability Thermal Gap Pad For Complex Parts Smd Led Module Video from China

Thermal Gap Pad

Apr 10, 2025

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Product Description: 4.0 MHz Moldability for Complex Parts Thermal Gap Pad for SMD LED Module The TIF1100-32-05US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional ...learn more

4.0 Mhz Moldability Thermal Gap Pad For Complex Parts Smd Led Module

4.0 Mhz Moldability Thermal Gap Pad For Complex Parts Smd Led Module

100000pcs/day

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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10 Years

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