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Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware
Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware
Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware
Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware
Specifications
Brand Name :
Ziitek
Model Number :
TIF400 Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware
Color :
Yellow
Thermal conductivity :
2.W/mK
Material :
Ceramic filled silicone elastomer
Hardness :
45 Shore 00
Thickness :
0.5mm-5.0mm
Feature :
Soft and compressible for low stress
Keywords :
Thermal Pad Gap Filling
Application :
Telecommunication Hardware,LED light,netbook
Description

Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


The TIF™400 is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF400 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware

Features

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

Applications

> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps

Typical Properties of TIF400 Series
Color Yellow Visual
Construction Ceramic filled silicone elastomer ******
Thermal Conductivity 2.0 W/mK ASTM D5470
Hardness 45 Shore 00 ASTM D2240
Operating Temp -45~200℃ *******
Specific Gravity 2.65 g/cc ASTM D297
Thickness range 0.02"-0.20" (0.5mm-5.0mm) ASTM D374
Dielectric Breakdown Voltage (T= 1mm above) >5500 VAC ASTM D149
Dielectric Constant @1MHz 4.7 ASTM D150
Volume Resistivity 5.3X10¹² Ohm-meter ASTM D257
Flame Rating 94 V0 UL E331100

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Standard Sheets Sizes:


8" x 16"(203mm x 406mm)
Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Peressure Sensitive Adhesive:


Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:


TIF™ series sheets type can add with fiberglass reinforced.

Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware

Packaging Details & Lead time

The packaging of thermal pad

1. with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Product tags

thermal conductive pad 2mm

,

thermoelectric peltier module bdt

,

arc tec thermoelectric pilter
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Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF400 Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware
Thermal Pad 2W/MK Silicon Thermal Pad Gap Filling For Telecommunication Hardware

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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