3W/mK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame
The TIF™500S Series TIFTM500s Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins orthe metal base.Their flexibility and elasticity make them suited to coat veryuneven surfaces.Heat can transmit to the metal housing or dissipation platefrom the heating elements or even the entire PCB, which effecitly enhancesthe efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive
> Soft and compressible for low stress applications
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
Applications
> CPU
> display card
> mainboard/mother board
> notebook
> power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
Typical Properties of TIF500S Series | ||
Color | Blue | Visual |
Construction | Ceramic filled silicone elastomer | ********** |
Thermal Conductivity | 3.2 W/mK | ASTM D5470 |
Hardness | 45 Shore 00 | ASTM 2240 |
Specific Gravity | 3.0 g/cc | ASTM D297 |
Thickness range | 0.020"-0.200" (0.5mm-5.0mm) | ASTM D374 |
Dielectric Breakdown Voltage (T= 1mm above) | >5500 VAC | ASTM D149 |
Dielectric Constant | 5.5 MHz | ASTM D150 |
Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
Continuous Use Temp | – 40 To 160℃ | ********** |
Outgassing (TML) | 40% | ASTM E595 |
Flame Rating | 94-V0 | UL E331100 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL