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Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Specifications
Brand Name :
Ziitek
Model Number :
TIF100-30-50U
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*14*13cm carton
Product name :
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Materials :
Ceramic filled silicone elastomer
Feature :
Ultra soft
Thermal conductivity :
3.0W/mK
Application :
CPU, Display card ,heat sink
Keyword :
Thermal Pad
Specific Gravity :
3.0 g/cm³
Hardness :
27±5 Shore 00
Sample :
Sample available
Description

Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIF™100-30-50U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive: 3 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Easy release construction
> Electrically isolating
> High durability
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF100-30-50U Series
Property Value Test method
Color Pink ******
Construction &Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.0g/cc ASTM D297
Hardness 27±5 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity ≥1.0X10¹² Ohm-meter ASTM D257
Flame rating 94 V0 equivalent UL
Thermal conductivity 3.0W/m-K ASTM D5470

Standard Thicknesses:
0.010" (0.25mm),0.020" (0.51mm),0.030" (0.76mm),0.040" (1.02mm),0.050" (1.27mm),

0.060" (1.52mm),0.070" (1.78mm),0.080" (2.03mm),0.090" (2.29mm) 0.100" (2.54mm),

0.110" (2.79mm),0.120" (3.05mm),0.130" (3.30mm),0.140" (3.56mm),0.150" (3.81mm),

0.160" (4.06mm),0.170" (4.32mm),0.180" (4.57mm),0.190" (4.83mm),0.200" (5.08mm)
Consult the factory alternate thickness.


Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Product tags

thermal gap filler pad

,

heat sink insulation pad

,

silicone heat sink pad
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Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF100-30-50U
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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