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Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
Specifications
Brand Name :
Ziitek
Model Number :
TIS680-10AB
Certification :
RoHS
Place of Origin :
China
MOQ :
5can
Price :
USD 1-50 / can
Payment Terms :
T/T
Supply Ability :
100000can/month
Delivery Time :
3-7 work days
Packaging Details :
1kg/can
Name :
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
Thermal conductivity :
1.0W/MK
keyword :
Thermally Conductive Potting Compound
Usage :
Potting
Application :
Capacitors and electrical devices
Hardness(shore A) @25℃ :
65
Description

Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

TIS680-10AB-Specification-sheet.pdf

Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

Features

> Good thermal conductive: 1.0W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance

Application

>To potting LED Lighting heat spreader and power- driver.
>Ferrite cements; tip type LED; good cementation to aromatic polyester

>Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics

>Power transformers and coils; Potting capacitors; Potting of small electrical devices
>Adhesion to metal glass and plastic;LCD & substrates adhesion; Coatingand sealant; Coil ; IGBTS;Transformer; Fire retardant
>Optical / medical component adhesive

Typical Properties of TIS™ 680-10AB Series
Typical Uncured Material
TISTM680-10A(Hardener) Mixing ratio (weight ratio)
Color white A:=1 :1
Viscosity @25℃ Brookfield 3500 mPa.s Viscosity @25℃ Brookfield 3500 mPa.s
specific Gravity 1.73g/cc³ specific Gravity 1.73g/cc³
Shelf life @25℃ in sealed container 6 months Working pot life(250g @25℃) 30 mins
TISTM680-10B(Resin) Cure Schedule
Color white Cure at 25C 3 hrs
Viscosity @25℃ Brookfield 3500 cPs
Shelf life @25℃ in sealed container 6 months Cure at 7o°c 20 mins
Cured Properties Value Test method
Hardness (Shore A)@25℃ 65 ASTM D2240
Operating temperature -40℃ ~160℃ ******
Glass transition temperature Tg 92℃ ******
Elongation 4.50% ASTM D412
Coefficient of thermal expansion, /℃ 3.0x 10^(-5) ******
Fire resistance uL 94 V-0 E331100
Moisture absorption % wt gain 24 hours water immersion @25℃ < 0.1 ASTM D570
Thermal Conductivity 1.0W/m-K ASTM D5470
Thermal Impedance @10psi 0.48℃*in²/W ASTM D5470
Dielectric Breakdown Voltage 200 volts / mil ASTM D149
Dielectric Constant@1MHz 4.5 ASTM D150
volume resistivity, ohm-cm @ 25℃ 3.0x 10^13 ASTM D257
Product packaging
1KG A/B for each tank.
5KG A/B each.
10KG A/B each.
Company profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Product tags

thermally conductive potting compound

,

high thermal conductivity potting compound

,

thermally conductive potting
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Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

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Product Detail
Brand Name :
Ziitek
Model Number :
TIS680-10AB
Certification :
RoHS
Place of Origin :
China
MOQ :
5can
Price :
USD 1-50 / can
Contact Supplier
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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