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High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
Specifications
Brand Name :
Ziitek
Model Number :
TIE380-25
Certification :
RoHS
Place of Origin :
China
MOQ :
10kg
Price :
1-100USD/kg
Payment Terms :
T/T
Supply Ability :
10000kg/month
Delivery Time :
3-8 work days
Packaging Details :
1kg/can
material :
epoxy glue
usage :
bonding electronics
appearance sured :
Dull Gray Solid
continuous use temp :
-40 to 180℃
thermal conductivity :
2.5 W/mK
NAME :
Thermal Epoxy Glue
Description

2022 high thermal conductivity thermal conductive epoxy glue good adhesive for bonding electronics

TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive

Product Summary:

TIE™380-25 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

Feature

Outstanding thermal performance 2.5W/mK
High tack surface reduces contact resistance
RoHS compliant
UL recognized
Fiberglass reinforced for puncture, shear and tear resistance
Easy release construction

Applications

Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices

Typical Properties of TIETM380-25
Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid Visual
Components One Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40 to 180℃ *****
Tensile strength Al/Al @25°C >2800psi *****
Thermal Conductivity 2.5 W/m-K ASTM D5470

Application Features:TIE™380-25

Color Gray

Viscosity@25℃ 140,000 cPs

Specific Gravity@25℃ 2.1 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃° 3 Hours

125℃ 1.5 Hour

150℃ 20 Minutes

170℃ 5 Minutes

Package:

1kg/can

High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

thermally conductive glue

,

thermal conductive glue

,

thermally conductive silicone adhesive
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High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

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Product Detail
Brand Name :
Ziitek
Model Number :
TIE380-25
Certification :
RoHS
Place of Origin :
China
MOQ :
10kg
Price :
1-100USD/kg
Contact Supplier
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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