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Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity
Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity
Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity
Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity
Specifications
Brand Name :
Ziitek
Model Number :
TIF180-30-06US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
hardness :
18 shore00
KEYWORD :
white silicone rubber pads
color :
white
part number :
TIF180-30-06US
material :
silicone
thermal conductive :
3.0W/mK
Description

Moldability for complex parts UL recognized thermal pad for power supply,2.0mmT

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

TIF100-30-06US.pdf

TIF180-30-06US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
<Good thermal conductive:3.0W/mK
<Thickness:2.0mmT
<Hardness:18 Shore 00
<Colour: white

<RoHS compliant

<UL recognized

<Fiberglass reinforced for puncture, shear and tear resistance

Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card


Typical Properties of TIF180-30-06US
Product Name

TIF180-30-06US Series
Colour
 white
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity
3.0 g/cc

Thickness
2.0mmT
Hardness
18 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity
Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity

FAQ

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Product tags

heat pad high thermal conductivity

,

thermal pad cpu

,

cpu thermal pads
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Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF180-30-06US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity
Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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