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TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 
TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 
TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 
TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 
Specifications
Brand Name :
Ziitek
Model Number :
TIF1120-40-11US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
Color :
gray
Density :
3.15g/cm3
thermal conductive :
4.0W/mK
hardness :
20 shore00
name :
TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules
keyword :
thermal gap pad
Description

Outstanding thermal performance TIF1120-40-11US thermal pad for Memory Modules ​

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


TIF100-40-11US-Series-Datasheet.pdf

TIF1120-40-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
<Good thermal conductive:4.0W/mK
<Thickness:3.0mmT
<Hardness:20 Shore 00
<Colour: gray

<Available in varies thicknesses

<Broad range of hardnesses available

<Moldability for complex parts

Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card


Typical Properties of TIF1120-40-11US
Product Name

TIF1120-40-11US Series
Colour
 gray
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity
3.15 g/cc

Thickness
3.0mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
4.0 W/mK
Volume Resistiviyt

6.0*1012 Ohm-cm

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 

Independent R&D team

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TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 

FAQ

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Product tags

thermal conductive silicone pad

,

heatsink cooling thermal conductive silicone pad

,

thermal conductive pad 2mm
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TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF1120-40-11US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 
TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules 

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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