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Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk
Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk
Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk
Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk
Specifications
Brand Name :
Ziitek
Model Number :
TIF1160-50-11US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
Volume Resistiviyt :
1.0*1012 Ohm-cm
hardness :
20 shore00
part number :
TIF1160-50-11US
thermal conductive :
5.0W/mK
Specific gravity :
2.9 g/cc
color :
gray
Description

insulation UL recognized silicone sheets for Telecommunication hardware,2.9 g/cc

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


TIF100-50-11US-Datasheet-REV02.pdf

TIF1160-50-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
<Good thermal conductive:5.0W/mK
<Thickness:4.0mmT
<Hardness:20 Shore 00
<Colour: gray

<Outstanding thermal performance

<High tack surface reduces contact resistance

<RoHS compliant

Applications

<Automotive electronics

<Set top boxes

<Audio and video components

<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling


Typical Properties of TIF1160-50-11US
Product Name

TIF1160-50-11US Series
Colour
 gray
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity
2.9 g/cc

Thickness
4.0mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
4.2 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
5.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk

FAQ

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

Product tags

micro atx htpc case

,

htpc micro atx case

,

amd thin client
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Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF1160-50-11US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk
Telecommunication Hardware Silicone Cpu Pad 2.9 G/Cc 5 W Mk

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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