Pink/White Outstanding Thermal Performance Thermal Pad for RDRAM Memory Modules
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
TIF200-20-02ES-Series-Datasheet.pdf
Ziitek TIF2160-20-02ES is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
<Moldability for complex parts
<Outstanding thermal performance
<High tack surface reduces contact resistance
<cooling components to the chassis of frame
<High speed mass storage drives
<Heat Sinking Housing at LED-lit BLU in LCD
<LED TV and LED-lit lamps
<RDRAM memory modules
<Micro heat pipe thermal solutions
Typical Properties of TIF2160-20-02ES | |||
Product Name | TIF2160-20-02ES Series | ||
Colour | Pink/White | ||
Construction & Compostion | Ceramic filled silicone elastomer | ||
Specific gravity | 2.8 g/cm^3 | ||
Thickness | 4.0mmT | ||
Hardness | 10 Shore 00 | ||
Dielectric constant@1MHz | 5.0 MHz | ||
Continuos Use Temp | -40 to 160℃ | ||
Dielectric Breakdown Voltage | >5000 VAC | ||
Thermal conductivity | 2.0W/mK | ||
Flame Rating | 94-V0 |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
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