5.0mmT High Durability Conductive Pads for Heat Pipe Thermal Solutions
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
TIF100N-40-10F-Specification-sheet.pdf
Ziitek TIF1200N-40-10F is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available
<mainboard/mother board
<notebook
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
Typical Properties of TIF1200N-40-10F | |||
Product Name | TIF1200N-40-10F Series | ||
Colour | Gray | ||
Construction & Compostion | Ceramic filled silicone elastomer | ||
Specific gravity | 2.1 g/cm^3 | ||
Thickness | 5.0mmT | ||
Hardness | 55±5 Shore 00 | ||
Dielectric constant@1MHz | 4.7 MHz | ||
Continuos Use Temp | -40 to 160℃ | ||
Dielectric Breakdown Voltage | >5500 VAC | ||
Thermal conductivity | 4.0W/mK | ||
Volume Resistivity | 1.0*1012 Ohm-cm |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
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