Specific Gravity 2.7 g/cc Good thermal conductive Conductive Pads for Mother Board
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
TIF100-20-10UF-Datasheet-REV02.pdf
Ziitek TIF140-20-10UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available
<mainboard/mother board
<notebook
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
Typical Properties of TIF140-20-10UF | |||
Product Name | TIF140-20-10UF Series | ||
Colour | Gray | ||
Construction & Compostion | Ceramic filled silicone elastomer | ||
Specific gravity | 2.7 g/cc | ||
Thickness | 1.0mmT | ||
Hardness | 75 Shore 00 | ||
Dielectric constant@1MHz | 4.6 MHz | ||
Continuos Use Temp | -40 to 160℃ | ||
Dielectric Breakdown Voltage | >5500 VAC | ||
Thermal conductivity | 2.0W/mK | ||
Volume Resistivity | 1.0*1012 Ohm-cm |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ