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CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness
CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness
CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness
CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness
Specifications
Brand Name :
Ziitek
Model Number :
TIF760PUS thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
Name :
China Wholesale CPU High Thermal Conductivity Die Cut Silicon Thermal Pad
Specific gravity :
3.2 g/cm³
Hardness :
20
Thickness :
1.5 mmT
Part number :
TIF760PUS
Keyword :
Thermal Pad
Description

China Wholesale CPU High Thermal Conductivity Die Cut Silicon Thermal Pad​

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

TIF700PUS-data sheet.pdf

CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness

Ziitek TIF760PUS is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

< Good thermal conductive: 7.5W/mK
< Thickness: 1.5mmT
< Hardness: 20
< Colour: gray

< RoHS compliant
< UL recognized
< Fiberglass reinforced for puncture, shear and tear resistance

Applications

> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

Typical Properties of TIF760PUS
Product Name TIF760PUS Series
Colour Gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity

3.2 g/cc
Thickness 1.5 mmT
Hardness(Shore 00) 20
Dielectric constant@1MHz 4.5 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >6000 VAC
Thermal conductivity 7.5W/mK
Flame Rating 94-V0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

Product tags

cpu thermal pads

,

thermal pad pcb

,

silicon free thermal gap pad
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CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF760PUS thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness
CPU Die Cut Silicon Thermal Pad with High Thermal Conductivity and 20 Hardness

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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