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3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices
3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices
3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices
3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices
Specifications
Brand Name :
Ziitek
Model Number :
TIF170-30-06UF thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
color :
white
Specific gravity :
3.0 g/cc
Name :
3.0 W/mK Good Performance Heat Sink Pad RoHS Compliant for Mass Storage Devices
Dielectric Constant :
5.0 MHz
Thermal conductivity :
3.0 W/mK
keyword :
Thermal Gap Pad
Description

3.0 W/mK Good Performance Heat Sink Pad RoHS Compliant for Mass Storage Devices

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

TIF100-30-06UF-Series-Datasheet-.pdf

Ziitek TIF170-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF170-30-06UF is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.


<Good thermal conductive:3.0 W/mK
<Thickness: 1.75mmT
<Hardness:75±5 Shore 00
<Colour: White

<Good thermal conductive
<Moldability for complex parts
<Soft and compressible for low stress applications

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIF170-30-06UF
Product Name

TIF170-30-06UF Series
Colour
 White
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity
3.0 g/cc

Thickness
1.75mmT
Hardness
75±5 Shore 00
Dielectric constant@1MHz
5.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistivity

2.3*1013 Ohm-cm


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices



Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

FAQ

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Product tags

thermal heatsink transfer pad

,

pad cooling parice

,

high performance thermal pad
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3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF170-30-06UF thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices
3.0 W/Mk Rohs Compliant Heat Sink Thermal Pad For Mass Storage Devices

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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