Specifications
Brand Name :
Ziitek
Model Number :
TIF1120-01US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
Name :
Moldability for complex parts 20 Shore 00 silicone pads for mainboard
Hardness :
20 Shore 00
Dielectric Breakdown Voltage :
>5500 VAC
keyword :
Thermal Gap Pad
Thickness :
3.0mmT
Volume Resistivity :
1.0*1012 Ohm-cm
Description

Moldability for complex parts 20 Shore 00 silicone pads for mainboard​

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

TIF100-01US-Series-Datasheet.pdf

Ziitek TIF1120-01US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

<Good thermal conductive:1.5 W/mK
<Thickness: 3.0mmT
<Hardness:20 Shore 00
<Colour: Black

<RoHS compliant
<UL recognized
<Easy release construction

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIFTIF1120-01US
Product Name

TIF1120-01US Series

Colour
Black
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

1.9 g/cc

Thickness

3.0mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
2.9 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
1.5 W/mK
Volume Resistivity

1.0*1012 Ohm-cm



Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

20 Shore 00 Mainboard 3 Mm Thermal Pad Moldability For Complex Parts



Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

20 Shore 00 Mainboard 3 Mm Thermal Pad Moldability For Complex Parts

FAQ

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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20 Shore 00 Mainboard 3 Mm Thermal Pad Moldability For Complex Parts

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Brand Name :
Ziitek
Model Number :
TIF1120-01US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
20 Shore 00 Mainboard 3 Mm Thermal Pad Moldability For Complex Parts
20 Shore 00 Mainboard 3 Mm Thermal Pad Moldability For Complex Parts

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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