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Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
Specifications
Brand Name :
Ziitek
Model Number :
TIF1120-10UF thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
Feature :
Electrically isolating
Dielectric constant :
3.9 MHz
Dielectric Breakdown Voltage :
>5500 VAC
Specific gravity :
2.2 g/cc
Name :
-40 to 160℃ Moldability for Complex Parts Conductive Pads for IT Infrastructure
keyword :
Thermal Gap Pad
Description

-40 to 160℃ Moldability for Complex Parts Conductive Pads for IT Infrastructure

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

TIF100-10UF-Datasheet-REV02.pdf

Ziitek TIF1120-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

<Good thermal conductive:1.5 W/mK
<Thickness: 3.0mmT
<Hardness:75 Shore 00
<Colour: Gray

<RoHS compliant
<UL recognized
<Fiberglass reinforced for puncture, shear and tear resistance

Applications

<Automotive electronics

<Set top boxes

<Audio and video components

<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling

Typical Properties of TIF1120-10UF
Product Name TIF1120-10UF Series
Colour gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity 2.2 g/cc
Thickness 3.0mmT
Hardness 75 Shore 00
Dielectric constant@1MHz 3.9 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 1.5 W/mK
Volume Resistivity 1.0*1012 Ohm-cm


Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Product tags

thermal conductive pads

,

heatsink thermal pads

,

heatsink cooling thermal conductive silicone pad
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Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF1120-10UF thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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