Specifications
Brand Name :
Ziitek
Model Number :
TIF1180-30-06UF thermal pad
Certification :
ISO9001
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
keyword :
thermal gap pad
Specific gravity :
3.0 g/cc
material :
silicone
Volume Resistivity :
2.3*1013 Ohm-cm
Name :
5.0 MHz Moldability for Complex Parts Heat Sink Pad for Memory Modules
Description

5.0 MHz Moldability for Complex Parts Heat Sink Pad for Memory Modules

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

TIF100-30-06UF-Series-Datasheet-.pdf

Ziitek TIF1180-30-06UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


<Good thermal conductive:3.0 W/mK
<Thickness: 4.5mmT
<Hardness:75±5 Shore 00
<Colour: White

<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIF1180-30-06UF
Product Name

TIF1180-30-06UF Series

Colour
White
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

4.5mmT
Hardness
75±5 Shore 00
Dielectric constant@1MHz
5.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistivity

2.3*1013 Ohm-cm


Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules



Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

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Brand Name :
Ziitek
Model Number :
TIF1180-30-06UF thermal pad
Certification :
ISO9001
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules
4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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