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Manufacture Thermal Conductive Silicone Potting For Electronic Components
Manufacture Thermal Conductive Silicone Potting For Electronic Components
Specifications
Brand Name :
Ziitek
Model Number :
TIF015-07
Certification :
UL
Place of Origin :
China
MOQ :
1000tube
Price :
0.1-100USD/KG
Payment Terms :
T/T
Supply Ability :
10000KG/MONTH
Delivery Time :
3-8 WORK DAYS
Packaging Details :
300cc/tube
Products name :
Manufacture Thermal Conductive Silicone Potting For Electronic Components
Application :
Electronic Components
Color :
Green
Materail :
Ceramic filled silicon material
Continuous use temp :
-45-200 ℃
Thermal conductivity :
1.5W/m-K
keyword :
Thermal Conductive Silicone Potting
Description

Manufacture Thermal Conductive Silicone Potting For Electronic Components

TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF100-15 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.


TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-15 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.


TIF015-07 Series Datasheet-REV02.pdf

Feature
> Thermal conductivity: 1.5 W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly
> Proven long-term reliability

Application
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling

TIFTM015-07 Property
Property Value Test method
Color Green Visual
Construction & Composition Ceramic filled silicon material *****
Viscosity 4000 Pa.s GB/T 10247
Specific Gravity 2.5g/cm³ ASTM D297
Thermal conductivity 1.5 W/mK ISO 22007-2
Thermal diffusivity 0.847 mm²/s ISO 22007-2
Specific heat capacity 2.2 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C ******
Flame Rating 94V0 UL E331100

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

Manufacture Thermal Conductive Silicone Potting For Electronic Components

Company Profile

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Q&A

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Product tags

thermal conductive adhesive for led

,

silicone led light

,

silicone led
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Manufacture Thermal Conductive Silicone Potting For Electronic Components

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF015-07
Certification :
UL
Place of Origin :
China
MOQ :
1000tube
Price :
0.1-100USD/KG
Contact Supplier
Manufacture Thermal Conductive Silicone Potting For Electronic Components

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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