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New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling
New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling
New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling
New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling
New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling
New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling
Specifications
Brand Name :
Ziitek
Model Number :
TIF1100-12U Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*23*12cm cantons
Thickness :
2.5mmT
Specific Gravity :
2.5 g/cc
Dielectric Breakdown Voltage :
>5500 VAC
Thermal conductivity :
1.5W/m-K
color :
blue
Description

New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


The TIF1100-12U Series is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Features
> Good thermal conductive: 1.5W/mK
> UL recognized
> Available in varies thicknesses
> High tack surface reduces contact resistance

> Moldability for complex parts

> Soft and compressible for low stress applications

> Moldability for complex parts

>Electrically isolating


Applications

>power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

> Set top boxes

> Audio and video components

> IT infrastructure

Typical Properties of TIF1100-12U Series
Color
 Blue
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.5 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.020"-0.200"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
27 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 >5500 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.45%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20

Volume Resistivity
1.0X10"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL

Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Q&A

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

TIF100-12U Series Datasheet-(E)-REV02-CRM.pdf

Product tags

thermal gap filler pad

,

silicon free thermal gap pad

,

heatsink cooling thermal conductive silicone pad
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New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF1100-12U Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling
New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling
New type Soft and compressible for low stress applications 2.5mmThermal Gap Padgood performance For PCB Cooling

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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