MachineU > China Products > Consumer Electronic > Computer Hardware & Software > Laptop Cooling Pads
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
Specifications
Brand Name :
Ziitek
Model Number :
TIF500US Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*23*12cm cantons
Thickness :
0.50-5.0mmT
Specific Gravity :
2.95g/cc
Dielectric Breakdown Voltage :
>5500 VAC
Thermal conductivity :
2.6W/m-K
color :
Violet
Description

high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


TIF500US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features
> Good thermal conductive: 2.6W/mK
> Available in varies thickness
> Moldability for complex parts
> Broad range of hardnesses available
> High tack surface reduces contact resistance

>Broad range of hardnesses available

>Easy release construction

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Rainproof LED Power
> Telecommunication hardware

> mainboard/mother board

> IT infrastructure

> GPS navigation and other portable devices

>LED Flesible strip, LED bar

Typical Properties of TIF500US Series
Color
 Violet
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.10 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.010"-0.200"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
45 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 >10000 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.35%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.3 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20

Volume Resistivity
4.2X1013
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
2.6W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board

high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board

FAQ

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board

TIF500US Datasheet -REV02.pdf

Product tags

thermal pad cpu

,

cpu thermal pads

,

laptop gpu thermal pad
Send your message to this supplier
Send Now

high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board

Ask Latest Price
Watch Video
Product Detail
Brand Name :
Ziitek
Model Number :
TIF500US Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products CPU Thermal Pad
MachineU China Products Consumer Electronic Computer Hardware & Software Laptop Cooling Pads
Contact Supplier
Submit Requirement