MachineU > China Products > Consumer Electronic > Computer Hardware & Software > Laptop Cooling Pads
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
Specifications
Brand Name :
Ziitek
Model Number :
TIF5200-30-11US CPU Thermal Pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*24*13cm canton
hardness :
20shore00
KEYWORD :
Gray silicone rubber pads
color :
Gray
part number :
TIFT5200-30-11US
material :
silicone
Construction :
Ceramic filled silicone elastomer
Description

new developed ultra soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 RoHS compliant For RDRAM memory modules

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

TIF500-30-11US Datasheet-REV02.pdf

TIF5200-30-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heatgenerating electronic components.
Features
Broad range of hardnesses available 3.0 W/mK
Electrically isolating

Outstanding thermal performance
Thickness:5.0mmT


Applications
Mass storage devices
Broad range of hardnesses available
Handheld portable electronics
Audio and video components
Handheld portable electronics
GPS navigation and other portable devices
CD-Rom, DVD-Rom cooling


Typical Properties of TIF5200-30-11US
Product Name
TIF5200-30-11US Series
Colour
 Gray
Construction & Compostion
Ceramic filled silicone rubber
Specific Gravity
2.9 g/cc
Operating Temp
-40 ~160 ℃
Hardness
20Shore 00
Dielectric Breakdown Voltage
>5500 VAC
Flame Rating
94 -V0
Dielectric Constant@1MHz
 4.0 MHz
Thermal conductivity
3.0W/mK
Thickness
 5.0mmT

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.

FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Product tags

zotac mini itx motherboard

,

intel mini pc nuc

,

amd thin mini itx motherboard
Send your message to this supplier
Send Now

Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules

Ask Latest Price
Watch Video
Product Detail
Brand Name :
Ziitek
Model Number :
TIF5200-30-11US CPU Thermal Pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules
Ultra Soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 For RDRAM Memory Modules

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products CPU Thermal Pad
MachineU China Products Consumer Electronic Computer Hardware & Software Laptop Cooling Pads
Contact Supplier
Submit Requirement