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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound
Specifications
Brand Name :
Ziitek
Model Number :
TIE™380-25
Certification :
RoHS
Place of Origin :
China
MOQ :
10kg
Price :
1-100USD/kg
Payment Terms :
T/T
Supply Ability :
10000kg/month
Delivery Time :
3-8 work days
Packaging Details :
1kg/can
Products name :
High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound
Material :
Epoxy glue
Usage :
bonding electronics
Appearance sured :
Dull Gray Solid
Continuous use temp :
-40 to 180℃
Thermal conductivity :
2.5 W/mK
Keywords :
Thermal Epoxy Glue
Description

High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound

Product Summary:

TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength.

TIETM380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

Spec-of-TIE380-25.pdf

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

Feature

> Outstanding thermal performance 2.5W/mK
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction

Applications

> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers

Typical Properties of TIETM380-25
Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid Visual
Components One Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40 to 180℃ *****
Tensile strength Al/Al @25°C >2800psi *****
Thermal Conductivity 2.5 W/m-K ASTM D5470
Packing details

1kg/can

 *****

Application Features:TIE™380-25

Color Gray

Viscosity@25℃ 140,000 cPs

Specific Gravity@25℃ 2.1 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃° 3 Hours

125℃ 1.5 Hour

150℃ 20 Minutes

170℃ 5 Minutes

Company profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

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Product Detail
Brand Name :
Ziitek
Model Number :
TIE™380-25
Certification :
RoHS
Place of Origin :
China
MOQ :
10kg
Price :
1-100USD/kg
Contact Supplier
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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