One Component Room Temperature Cured 1.0W/MK Thermally Conductive Silicone Adhesive

TIS™580-10 Series is dealcoholized,one component, room temperature cure thermally conductive silicone adhesive. lt possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance.Thus, heat transfer among heat source, heat-sink, motherboard,metal casing will become effective.TIS™580-10 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel,etc.As this is a dealcoholized system, it will not corrode, especially, metalsurfaces.

SPEC-of-TIS580-10.pdf

Feature

> Good thermal conductive: 1.0W/mK

> Excellent maneuverability and good adhesion

> Low shrinkage
> Low viscosity, Leads to void-free surface

> Good solvent resistance ,water resistance

> Long working life

> Excellent thermal shock resistance

Application

lt mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-10,resulting a more reliable gap-filling thermal conduction,simplified handling and more cost-effective.E.g. Massive application in integrated circuits in portable computer, microprocessor, highpower LED, internal storage module, cache,integrated circuits, DCIAC translator,IGBT and other power modules, encapsulation of semi-conductors,relay switches, rectifiers and transfomers.

Packing:
100ml ! pc,100pc / box; 300ml / pc, 24pc / box

Storage and transportation:
1.Store in cool, dry place. Shelf life: 6 months (25℃)
2.This product is non-hazardous, refers to local general chemical transportation regulation