TIS-30FIP Series Elastomer Gasket Material For Optical And Medical Component Adhesive
TIF-30FIP is a Nickel Graphite filled silicone paste with very low hardness which contributes to relatively low compression force when it is used as dispensed gaskets in between of chassis and cover. lt is also designed to beused under high compression rate up to 60% so that the gaskets can compensate large tolerance of substrates. lt also has good shielding performance with balanced mechanical properties.This grade end in a very cost effective FIP solution through its low density and fast dispensing speed.Ziitek's Form-In-Place is an automated system for dispensing conductive elastomer EMl shielding and grounding gaskets onto metal or plastic substrates.This product is particularly ideal for base stations, PDAs, PCcards, radios, mobile phones, as well as many other cast or plastic enclosures and packaged electronic assemblies.
FEATURES AND BENEFITS
>Form-in-place gasketing offers a totalcost savings in the form of reduced raw materials, labor or assembly time
> Room temperature cure gasketingmaterials eliminate the need for costly heat curing systems, allowing the use ofinexpensive plastic or metal substrates
>Single-component compounds eliminate the need for mixingingredients, thereby shortening production cycles and eliminating related waste
>Easy to program operating system allows for quick part-topart change-over,minimal tooling investment for new designs, and prototype development in 24 to 48 hours
>Low compression force makes SN compounds an excellent selection wherethe mating surfaces lack mechanical stiffness Form-in-place gaskets provide morecritical packaging space for board level components and smallerpackage dimensions
>High shielding effectiveness:85~100dB up to 10GHz
Applications
>Automotive starters potting; General potting;Thermal detector potting
>Ferrite adhesion;TIP type LED; Good adhesion to aromatic polyester
>Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics
>Power transformers and coils; Potting capacitors; Potting of small electricaldevices
>Adhesion to metal and plastic; LCD & substrates adhesion;Coating andsealant; Coil ; IGBTS; Transformer; Fire retardant
>Optical / medical component adhesive
Typical Properties of TIS-30FIP Series
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Property | Value | Test Method |
structure constitution |
Nickel/Graphite |
***** |
Shielding Effectiveness 200MHz~10GHz(dB) |
>80 | MIL-DTL-83528C |
Hardness ShoreA | 45 | ASTM2240 |
Density cured(g/cm³) | 1.6 | ASTM D792 |
Density unccured(g/cm³) | 1.8 | ASTM D792 |
Temperature Range |
-50~125℃ | ****** |
Volume Resistivity | ≤0.04Ω.cm | ASTM D257 |
Compression Range |
10%~60% | ASTM D575 |
20% Compression (lblin) |
0.6 | ASTM D575 |
40% Compression (lblin) |
1.6 | ASTM D575 |
UL Flammability Rating |
94-V0 | UL E331100 |
Adhesion strengh (AL) |
>150N/m² | LT-FIP-CLE-03 |
Cure Conditions |
15℃ to 40℃,RH50%, 24hours | ***** |
Independent R&D team
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