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High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive
High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive
High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive
High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive
Specifications
Brand Name :
Ziitek
Model Number :
TIE280-12AB
Certification :
RoHS
Place of Origin :
China
MOQ :
10kg
Price :
1-100USD/kg
Payment Terms :
T/T
Supply Ability :
10000kg/month
Delivery Time :
3-8 work days
Packaging Details :
1kg/can
material :
epoxy glue
usage :
bonding electronics
appearance sured :
Dull Gray Solid
continuous use temp :
-40 to 160℃
thermal conductivity :
1.2 W/mK
NAME :
Thermal Conductive Glue
Description

Thermal Conductive Glue Electronic Epoxy Resin Adhesive

TIE™280--12AB is a two-component, high thermal conductivity, room-temperature curing, long working time and fireproof epoxy resin potting compound, which is especially suitable for potting capacitors and small electronic devices.

Product Summary:

TIE™280-12AB is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIE280-12AB-Series-Datasheet.pdf

Feature

Outstanding thermal performance 1.2W/mK
High tack surface reduces contact resistance
RoHS compliant
UL recognized
Fiberglass reinforced for puncture, shear and tear resistance
Easy release construction

Applications

Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices

Typical Properties of TIETM280-12A
Chemical type Epoxy Test Method
Appearance uncured Black Paste Visual
Appearance cured Dull Black Solid Visual
Components Two Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 85 Shore D ASTM 2240
Continuous Use Temp -40 to 160℃ *****
Tensile strength Al/Al @25°C >10,000psi *****
Thermal Conductivity 1.2 W/m-K ASTM D5470

Application Features:

TIE™380-12A

Color Black

Viscosity@25℃ 15,000 cPs

Shelf life @25℃° 12Months

TIE™380-12B

Color Black

Viscosity@25℃ 7,000 cPs

Shelf life @25℃° 12Months

TIE™380-12AB(Two Component Mix)

Viscosity(@25℃ )1,000 cPs

Operating time9(@ 25℃)45Minutes

Specific Gravity (@25℃) 1.6 g/cc

Shelf life( @25℃°) 12Months

Curing procedures:

Curing temperature Curing time

25℃° 3 Hours

70℃ 30Minutes

Package:

1KG A/B for each tank. 5KG A/B each. 10KG A/B each.

High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

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Product Detail
Brand Name :
Ziitek
Model Number :
TIE280-12AB
Certification :
RoHS
Place of Origin :
China
MOQ :
10kg
Price :
1-100USD/kg
Contact Supplier
High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive
High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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