Specifications
Brand Name :
Ziitek
Model Number :
TIS100-05 Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/pcs
Delivery Time :
3-6 work days
Packaging Details :
24*23*12CM
keyword :
Electrical Insulation
application :
CPU GPU Gap Filling
continous use temp :
-45 to 180℃
compliance :
UL & RoHS
materials :
Ceremic filled silicone elastomer
feature :
High thermal conductive and High dielectric etrength
Description

CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling

Company pfrofile

With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling

Products details:

TIS100-05 Series products are the high-efficiency insulation ones with thermal conduction properties.The supplement of the insulation base film made by silica gel into the heat-conduction material creates a great effect on both the insulation and heat conduction.​

TIS100-05-Serice-Datasheet-REV01.pdf

CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling


Features:


> High thermal conductive and High dielectric etrength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:


> Car Battery & Power Supply
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers

Typical Properties of TIS100-05 series
Product Name TIS109-05 TIS112-05 TIS118-05 Test Method
Color blue Visual
Construction &Compostion Ceramic filled silicone elastomer / Fiberglass *******
Composite Thickness 0.23mm 0.3mm 0.45mm ASTM D374
Hardness 50 Shore 00 ASTM D751
Specific Gravity 1.72g/cc ASTM D297
Tensile Strength 425 Kpsi ASTM D412
Continuous Use Temp -45 to 180℃ *******
Dielectric Breakdown Voltage >3500 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 4.0X10¹³ Ohm-meter ASTM D257
Flame Rating 94 V0 E331100
Thermal conductivity 1.0 W/mK ASTM D5470

Standard Thicknesses:
0.009"(0.228mm)0.012"(0.304mm)0.018"(0.457mm)

Consult the factory alternate thickness.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.

Request adhesive on doule side with "A2" suffix.

Standard Sizes:
12" x 160"(304mm x 48.76M)
lndividual die cut shapes can be supplied.

Packaging Details & Lead time

The packaging of thermal insulation materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling

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Brand Name :
Ziitek
Model Number :
TIS100-05 Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/pcs
Contact Supplier
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CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling
CPU GPU Gap Filling Material Thermally Conductive Electrical Insulation Silicone Pad for Heatsink Cooling

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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