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10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad
10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad
10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad
10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad
Specifications
Brand Name :
Ziitek
Model Number :
TIF100C 10075-11
Certification :
RoHS and UL recognized
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad
Thinkness range :
0.020"(0.50mm)~0.200"(5.00mm)
Hardness :
75 Shore 00
Thermal Conductivity :
10.0W/mK
Color :
Gray
Flam rating :
94 V-0
Application :
Electronic Products Thermal Gap Filler Pad
Keywords :
Silicone Thermal Pad
Description

10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.

Features:
> Excellent thermal conductivity10.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available


Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU And GPU processors and other chipsets
> Display card
> Mainboard/mother board
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

Typical Properties of TIF®100C 10075-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.3g/cc ASTM D297
thickness 0.020"(0.50mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness＜1.0mm) 75 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 5.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 10.0W/m-K ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.

10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF100C 10075-11
Certification :
RoHS and UL recognized
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad
10.0W Thermal Silicone Thermal Pad Insulation Materail Pads Electronic Products Thermal Gap Filler Pad

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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