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High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
Specifications
Brand Name :
Ziitek
Model Number :
TIF100 6520-11
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
Thinkness range :
0.020"(0.50mm)~0.200"(5.00mm)
Keywords :
Silicone Thermal Pad
Hardness :
20 Shore 00
Thermal Conductivity :
6.5W/mK
Color :
Gray
Flam rating :
94 V-0
Density :
3.3g/cc
Application :
Electronics Cooling
Description

High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

Company Profile

ZiitekZiitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling efficient heat tansfer from discrete components or the entire PCB to the metal housing or heat sink ,This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

Features:
> Excellent thermal conductivity 6.5W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Easy release construction
> Electrically isolating
> High durability


Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU And GPU processors and other chipsets
> Display card
> Mainboard/mother board
> Memory Modules
> Audio and video components
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

Typical Properties of TIF®100 6520-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.3g/cc ASTM D297
thickness 0.020"(0.50mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness＜1.0mm) 20 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage ≥5000 VAC ASTM D149
Dielectric Constant 6.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 6.5W/m-K ASTM D5470

Product Specification
Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

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High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF100 6520-11
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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