500mW SOD-123 1206 Package Plastic-Encapsulate Zener Diodes BZT52C2V4-BZT52C43
Features
Planar die construction
500mW power dissipation on ceramic PBC
General purpose, medium current
Ideally suited for automated assembly processes
Available in lead free version
Maximum Ratings(Ta=25℃ unless otherwise specified)
Characteristic | Symbol | Value | Unit |
Forward Voltage (Note 2) @ IF = 10mA | VF | 0.9 | V |
Power Dissipation(Note 1) | PD | 500 | mW |
Thermal Resistance from Junction to Ambient | R θJA | 357 | ℃/W |
Junction temperature | Tj | 150 | ℃ |
Storage temperature range | Tstg | -55~+150 | ℃ |
ELECTRICAL CHARACTERISTICS
T a =25 ℃ unless otherwise specified
Type Number | Type Code | Zener Voltage Range (Note 2) | Maximum Zener Impedance (Note 3) | Maximum Reverse Current (Note 2) | Typical Temperature Coefficient @I ZTC mV/ ℃ | Test Current I ZTC | ||||||||
VZ @IZT | IZT | ZZT @I ZT | ZZK @IZK | IZK | IR | VR | ||||||||
Nom V | Min(V) | Max(V) | (mA) | Ω | (mA) | μA | V | Min | Max | mA | ||||
BZT52C2V4 | WX | 2.4 | 2.2 | 2.6 | 5 | 100 | 600 | 1.0 | 50 | 1.0 | -3.5 | 0 | 5 | |
BZT52C2V7 | W1 | 2.7 | 2.5 | 2.9 | 5 | 100 | 600 | 1.0 | 20 | 1.0 | -3.5 | 0 | 5 | |
BZT52C3V0 | W2 | 3.0 | 2.8 | 3.2 | 5 | 95 | 600 | 1.0 | 10 | 1.0 | -3.5 | 0 | 5 | |
BZT52C3V3 | W3 | 3.3 | 3.1 | 3.5 | 5 | 95 | 600 | 1.0 | 5 | 1.0 | -3.5 | 0 | 5 | |
BZT52C3V6 | W4 | 3.6 | 3.4 | 3.8 | 5 | 90 | 600 | 1.0 | 5 | 1.0 | -3.5 | 0 | 5 | |
BZT52C3V9 | W5 | 3.9 | 3.7 | 4.1 | 5 | 90 | 600 | 1.0 | 3 | 1.0 | -3.5 | 0 | 5 | |
BZT52C4V3 | W6 | 4.3 | 4.0 | 4.6 | 5 | 90 | 600 | 1.0 | 3 | 1.0 | -3.5 | 0 | 5 | |
BZT52C4V7 | W7 | 4.7 | 4.4 | 5.0 | 5 | 80 | 500 | 1.0 | 3 | 2.0 | -3.5 | 0.2 | 5 | |
BZT52C5V1 | W8 | 5.1 | 4.8 | 5.4 | 5 | 60 | 480 | 1.0 | 2 | 2.0 | -2.7 | 1.2 | 5 | |
BZT52C5V6 | W9 | 5.6 | 5.2 | 6.0 | 5 | 40 | 400 | 1.0 | 1 | 2.0 | -2.0 | 2.5 | 5 | |
BZT52C6V2 | WA | 6.2 | 5.8 | 6.6 | 5 | 10 | 150 | 1.0 | 3 | 4.0 | 0.4 | 3.7 | 5 | |
BZT52C6V8 | WB | 6.8 | 6.4 | 7.2 | 5 | 15 | 80 | 1.0 | 2 | 4.0 | 1.2 | 4.5 | 5 | |
BZT52C7V5 | WC | 7.5 | 7.0 | 7.9 | 5 | 15 | 80 | 1.0 | 1 | 5.0 | 2.5 | 5.3 | 5 | |
BZT52C8V2 | WD | 8.2 | 7.7 | 8.7 | 5 | 15 | 80 | 1.0 | 0.7 | 5.0 | 3.2 | 6.2 | 5 | |
BZT52C9V1 | WE | 9.1 | 8.5 | 9.6 | 5 | 15 | 100 | 1.0 | 0.5 | 6.0 | 3.8 | 7.0 | 5 | |
BZT52C10 | WF | 10 | 9.4 | 10.6 | 5 | 20 | 150 | 1.0 | 0.2 | 7.0 | 4.5 | 8.0 | 5 | |
BZT52C11 | WG | 11 | 10.4 | 11.6 | 5 | 20 | 150 | 0.5 | 0.1 | 8.0 | 5.4 | 9.0 | 5 | |
BZT52C12 | WH | 12 | 11.4 | 12.7 | 5 | 25 | 150 | 0.5 | 0.1 | 8.0 | 6.0 | 10 | 5 | |
BZT52C13 | WI | 13 | 12.4 | 14.1 | 5 | 30 | 170 | 0.5 | 0.1 | 8.0 | 7.0 | 11 | 5 | |
BZT52C15 | WJ | 15 | 13.8 | 15.6 | 5 | 30 | 200 | 0.5 | 0.1 | 10.5 | 9.2 | 13 | 5 | |
BZT52C16 | WK | 16 | 15.3 | 17.1 | 5 | 40 | 200 | 0.5 | 0.1 | 11.2 | 10.4 | 14 | 5 | |
BZT52C18 | WL | 18 | 16.8 | 19.1 | 5 | 45 | 225 | 0.5 | 0.1 | 12.6 | 12.4 | 16 | 5 | |
BZT52C20 | WM | 20 | 18.8 | 21.2 | 5 | 55 | 225 | 0.5 | 0.1 | 14.0 | 14.4 | 18 | 5 | |
BZT52C22 | WN | 22 | 22.8 | 23.3 | 5 | 55 | 250 | 0.5 | 0.1 | 15.4 | 16.4 | 20 | 5 | |
BZT52C24 | WO | 24 | 22.8 | 25.6 | 5 | 70 | 250 | 0.5 | 0.1 | 16.8 | 18.4 | 22 | 5 | |
BZT52C27 | WP | 27 | 25.1 | 28.9 | 2 | 80 | 300 | 0.5 | 0.1 | 18.9 | 21.4 | 25.3 | 2 | |
BZT52C30 | WQ | 30 | 28.0 | 32.0 | 2 | 80 | 300 | 0.5 | 0.1 | 21.0 | 24.4 | 29.4 | 2 | |
BZT52C33 | WR | 33 | 31.0 | 35.0 | 2 | 80 | 325 | 0.5 | 0.1 | 23.1 | 27.4 | 33.4 | 2 | |
BZT52C36 | WS | 36 | 34.0 | 38.0 | 2 | 90 | 350 | 0.5 | 0.1 | 25.2 | 30.4 | 37.4 | 2 | |
BZT52C39 | WT | 39 | 37.0 | 41.0 | 2 | 130 | 350 | 0.5 | 0.1 | 27.3 | 33.4 | 41.5 | 2 | |
BZT52C43 | WU | 43 | 40.0 | 46.0 | 2 | 100 | 700 | 1 | 0.1 | 32 | 10 | 12 | 2 |
Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm 2 .
2. Short duration test pulse used to minimize self-heating effect.
3. f = 1kHz
Drawing:
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