Copper Content: | Min99.99 | Peel Strength: | 1.35N/MM |
---|---|---|---|
Thickness: | 0.035mm | Material: | Cu |
Density: | 8.9g/cm³ |
Dimension Range:
Copper Foil thickness from 12~100µm can be supplied for FPC.
Width can be made according to clients’ requirement up to 650mm.
Applications:
Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film.
Features:
The material has higher extensibility, and has a high bending resistance and no crack.
Table 1:FPC T2 high flex rolled copper foil properties (GB/T5230-2000,IPC-4562-2000)
Item | Unit | Parameters | |||||
12μm | 18μm | 25μm | 35μm | 70μm | |||
Mass per unit(±5%) | g/m² | 107 | 160 | 300 | 400 | 445 | |
Cu+Ag | % | ≥99.99 | |||||
Temper | H | O,H | O,H | O,H | O,H | ||
Surface roughness | Rz | μm | 0.4 | 0.5 | 0.7 | 0.74 | 0.76 |
Tensile strength | Normal Temp /23℃ | N/mm² | ≥430 | ≥450 | ≥450 | ≥460 | ≥460 |
High Temp /220℃ | N/mm² | ≥140 | ≥150 | ≥170 | ≥210 | ≥220 | |
Elongation | Normal Temp /23℃ | % | ≥1.5 | ≥3.0 | ≥4.0 | ≥4.2 | ≥4.5 |
High Temp /220℃ | % | ≥8 | ≥10 | ≥18 | ≥28 | ≥30 | |
Fatigue Resistance (annealed) | % | 65 | 65 | 65 | 65 | 65 | |
Hardness | HV | ≤50 | |||||
Maximum resistivity | Ωmm2/m | 0.0171 | |||||
Electrical conductivity | % | ≥98.3% | |||||
Pinhole test results | piece/㎡ | Pinhole area more than 0.5 mm²,0.005 piece/㎡ |
Note: 1. Above figures based on the material temper H.
2. Copper Foil has smooth and shiny surface,without any coating..
3. Testing method follows our company standard.