Specifications
Brand Name :
Texas Instruments
Model Number :
TLV314QDBVRQ1
MOQ :
1 piece
Payment Terms :
T/T
Delivery Time :
2~8 workdays
Brand :
Texas Instruments
Certificate :
/
Model :
TLV314QDBVRQ1
MOQ :
1 pc
Price :
Negotiated
Delivery :
2~8 workdays
Payment :
T/T
Description
PRODUCT DESCRIPTION
TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001
Amplifier IC Chips Texas Instruments/TI TLV314QDBVRQ1
ECAD Module PCB Symbol,Footprint & 3D Model
Supply and Demand Status Balance
Popularity High
Fake Threat In the Open Market 45 pct.
Quantity per package 3000
HTSUS 8542.33.0001
ECCN EAR99
REACH Status REACH Unaffected
MSL Level 2 (1 Year)
Case / Package SOT-23-5
Package SC-74A, SOT-753
Mounting Surface Mount
Operating Temperature Range -40°C ~ 125°C
Package Reel - TR
Series Automotive, AEC-Q100
Manufacturer Texas Instruments
Family Name TLV314
Estimated Pruduction Lead Time 34 Weeks
Categories Integrated Circuits (ICs)
Other Part Number -296-45322-1-ND, 296-45322-6, TLV314QDBVRQ1-ND, 296-45322-1, 296-45322-2
Win Source Part Number 936880-TLV314QDBVRQ1
Features CMOS Amplifier Circuit Rail-to-Rail SOT-23-5

Features for the TLV314-Q1

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C AmbientOperating Temperature Range
    • Device HBM ESD Classification Level 3A
    • Device CDM ESD Classification LevelC6
  • Low Offset Voltage: 0.75 mV (Typical)
  • Low Input Bias Current: 1 pA (Typical)
  • Wide Supply Range: 1.8 V to 5.5 V
  • Rail-to-Rail Input and Output
  • Gain Bandwidth: 3 MHz
  • Low IQ: 250 µA/Ch (Maximum)
  • Low Noise: 16 nV/√Hz at 1 kHz
  • Internal RF and EMI Filter
  • Number of Channels:
    • TLV314-Q1: 1
    • TLV2314-Q1: 2
    • TLV4314-Q1: 4
  • Extended Temperature Range:
    –40°C to +125°C

Description for the TLV314-Q1

The TLVx314-Q1 family of single-, dual-, and quad-channel operational amplifiersrepresents a new generation of low-power, general-purpose operational amplifiers. Rail-to-railinput and output swings (RRIO), low quiescent current (150 µA typically at 5 V) combine with a widebandwidth of 3 MHz to make this family very attractive for a variety of battery-poweredapplications that require a good balance between cost and performance. The TLVx314-Q1 familyachieves a low-input bias current of 1 pA, making it an excellent choice for high impedancesensors.

The robust design of the TLVx314-Q1 devices provides ease-of-use to the circuit designer:unity-gain stability, RRIO, capacitive loads of up to 300-pF, an integrated RF and EMI rejectionfilter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD)protection (4-kV HBM).

These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to+125°C.

The TLV314-Q1 (single) is available in both 5-pin SC70 and SOT-23 packages. TheTLV2314-Q1 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314-Q1 isoffered in a 14-pin TSSOP package.

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TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001

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Brand Name :
Texas Instruments
Model Number :
TLV314QDBVRQ1
MOQ :
1 piece
Payment Terms :
T/T
Delivery Time :
2~8 workdays
Brand :
Texas Instruments
Contact Supplier
TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001
TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001
TI Amplifier IC Chips TDA2030 Through Hole Mount TLV314QDBVRQ1 8542.33.0001

Guangzhou Topfast Technology Co., Ltd.

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