EU RoHS |
Compliant |
ECCN (US) |
EAR99 |
Part Status |
Active |
HTS |
8542330001 |
Automotive |
No |
PPAP |
No |
Type |
General Purpose |
Number of Channels per Chip |
2 |
Maximum Data Rate |
150Mbps |
Maximum Rise Time (ns) |
4 |
Maximum Fall Time (ns) |
4 |
Minimum Pulse Width (ns) |
5 |
Maximum Pulse Width Distortion (ns) |
5 |
Maximum Propagation Delay Skew (ns) |
5 |
Output Type |
CMOS |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum Operating Supply Voltage (V) |
2.5 |
Maximum Propagation Delay Time (tPHL) (ns) |
14 |
Minimum Isolation Voltage (Vrms) |
5000 |
Maximum Propagation Delay Time (tPLH) (ns) |
14 |
Maximum Working Insulation Voltage |
1200Vp |
Maximum Quiescent Supply Current (mA) |
10.6/11.4 |
Maximum Output Current Drive (mA) |
10 |
Maximum Power Dissipation (mW) |
150 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Typical Operating Supply Voltage (V) |
5|3.3 |
Forward/Reverse Channels |
1月1日 |
Minimum Common Mode Rejection (kV/us) |
35 |
Coupling Type |
Capacitive Coupling |
Supplier Package |
SOIC W |
Pin Count |
16 |
Mounting |
Surface Mount |
Package Height |
2.05(Min) |
Package Length |
10.3 |
Package Width |
7.5 |
PCB changed |
16 |
|
|