Titanium Tube Target Titanium Gr2 ASTM B861-06 a 133OD*125ID*2140L Target Sputtering

The coating target is a sputtering source that forms various functional films on the substrate by magnetron sputtering, multi-arc ion plating or other types of coating systems under appropriate technological conditions. To put it simply, the target material is the target material of high-speed charged particles bombardment. When used in high-energy laser weapons, different power densities, different output waveforms and different wavelengths of laser interact with different targets, different killing and destruction effects will be produced. Among all the application industries, the semiconductor industry has the most stringent quality requirements for target sputtering films. Today, 12-inch (300 epistaxis) silicon chips have been made. The interconnects are shrinking in width. Wafer manufacturers require large size, high purity, low segregation and fine grain, which requires better microstructure of the manufactured target. The crystal particle diameter and uniformity of target material have been considered as the key factors affecting the deposition rate of thin films. In the aspect of storage technology, the development of high-density and large-capacity hard disks requires a large number of GMR films. CoF~Cu multilayer composite films are now widely used in GMR films. The TbFeCo alloy target material needed for the magneto-optical disc is still being further developed. The magneto-optical disc made with it has the characteristics of large storage capacity, long service life and repeated non-contact erasable writing.

Features

1. Low density and high strength
2. Customized according to the drawings required by customers
3. Strong corrosion resistance
4. Strong heat resistance
5. Low temperature resistance
6. Heat resistance