Good electrical conductivity; widely used in lighting and welding industries because of its good electrical conductivity;
Has good weldability and workability.
Specific gravity: | The general specific gravity is 16.5-18.75g/cm3; |
High strength: | Tensile strength is 700-1000Mpa; |
Strong ability to absorb rays: | 30-40% higher than lead; |
High thermal conductivity: | The thermal conductivity of tungsten alloy is 5 times that of die steel; |
Small thermal expansion coefficient: | only 1/2-1/3 of iron or steel; |
Application:
Vapor Chambers are designed for vastly improved thermal performance over traditional solid metal heat spreaders found in traditional CPU coolers. A vapor chamber is basically a flat metal enclosure with a wick structure lining.
Vapor chambers, also known as planar heat pipes or heat spreaders, are two-phase devices with a large, flat surface that efficiently spread heat from high power or high heat flux electronics. Typically used in place of the base plate in a standard metal heat sink or heat pipe in a two-phase heat sink, these devices can reduce the conduction loss (Delta-T) in a thermal assembly by 50% or more, resulting in a solution with lower overall thermal resistance.
Vapor chamber use has surged in recent years, largely due to increases in power density resulting from shrinking die size. Notably, modern-day vapor chambers offer improved capabilities and lower costs compared to those available just a decade ago, enhancing their price-performance value proposition and application flexibility.
Manufacturing traditional vapor chambers involves two stamped metal plates that mirror each other in shape, allowing for a range of designs from a basic square to more complex configurations. While vapor chambers typically don't exceed 400mm for electronics cooling applications, they can be made as wide as 150mm offering an expansive surface area from which to dissipate heat. Additionally, each of the two plates can have embossments or reliefs stamped into the design, allowing the device to better accommodate variations in component height along the PCB.