Specifications
Brand Name :
Ring or support OEM
Model Number :
High Speed PCB(customizable)
Certification :
ISO9001, ISO14001, ISO13485, and IATF16949.
Place of Origin :
Shenzhen, China
MOQ :
1unit
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
50000㎡per week
Delivery Time :
7-14 working days
Packaging Details :
Vacuum packing+Cardboard packing case
PCB type :
High Speed PCB boards (customizable)
Minimum Hole Size (Micro-via) :
Typically 0.2mm - 0.4mm
Line Width/Spacing :
Usually 0.1mm - 0.3mm
Layer Count :
Up to 40 layers or customizable
Material Types :
FR4, High-Tg FR4, Polyimide, Rogers, PTFE
Surface Finishes :
ENIG, HASL, Immersion Silver, Immersion Tin
Certifications :
IPC, RoHS, UL, ISO9001, ISO14001,ISO13485,IATF16949
Copper Thickness (Inner/Outer Layers) :
Common values are 1oz, 2 or customizable
Application Areas :
Telecommunications,Automotive, smartphone,Consumer Electronics
Inspection Techniques :
AOI, X-Ray, Electrical Testing
Description

Ring PCB, your PCB & PCBA Turnkey Solutions | Professional Circuit Manufacturing Expert
Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

1.What are High-speed PCBs?

High - speed PCB refers to a printed circuit board designed for high - speed signal transmission. Here are the details:

A high - speed PCB is a type of circuit board where the electrical signals operate at high frequencies and data rates, typically above 1GHz or with rise and fall times less than 1 nanosecond.

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

2.Characteristics of High speed PCB:

- Low Signal Delay: The layout and materials are optimized to minimize the time it takes for signals to travel along the traces, ensuring accurate and timely signal transmission.

- Controlled Impedance: The PCB has precisely controlled impedance values of the signal traces. This is crucial to prevent signal reflection and distortion, which can occur when the impedance changes abruptly.

- Reduced Crosstalk: Special design techniques are employed to minimize the interference between adjacent signal traces. This includes proper spacing, shielding, and use of differential signaling.

3.Design Considerations

- Layer Stack - up Design: The arrangement of different layers, such as signal layers, power planes, and ground planes, is carefully planned to achieve the desired electrical characteristics.

- Trace Routing: Signal traces are routed in a way that minimizes their length and avoids sharp bends or discontinuities.

- Component Placement: Components are placed strategically to reduce signal path lengths and to facilitate proper routing of traces.


3. Customizable Design
Understanding diverse project needs, Ring PCB custom all kinds of PCB boards. Whether it’s adjusting layer structures, material selection, or form factors, we ensure the boards perfectly match your product requirements.

If you are interested in our Heavy copper PCB circuit boards, please provide your customized needs, we will complete the sample production within 7 working days, and complete mass production and delivery within 15 working days.

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

4.Challenges of Manufacturing High-speed PCBs

1. Material Selection

High-speed PCBs require specialized materials with low dielectric constants and low loss tangents to minimize signal degradation. Ring PCB employs appropriate high-frequency laminates, such as Rogers and Isola, ensuring optimal material selection based on the specific application and performance requirements.

2. Impedance Control

Variations in impedance can lead to signal reflections and crosstalk. Our engineering team utilizes advanced simulation tools to design traces with precise widths and spacing, ensuring consistent impedance. We also optimize the layer stack-up to enhance signal integrity and minimize interference.

3. Signal Integrity and Crosstalk

High-speed signals are susceptible to crosstalk and noise, which can degrade performance and reliability. Ring PCB employs differential pair routing techniques and advanced layout strategies to minimize crosstalk. We conduct thorough signal integrity analysis and simulations to identify potential issues before manufacturing.

4. Thermal Management

High-speed circuits generate more heat. We integrate effective thermal management solutions, such as thermal vias and copper pours, during the design phase. Our engineers analyze thermal performance to ensure optimal heat dissipation throughout the PCB.

5. Precision Manufacturing

The intricate designs of high-speed PCBs require high precision in fabrication, including fine trace widths and tightly packed components. Ring PCB uses state-of-the-art manufacturing equipment to achieve the precision. Our skilled operators and stringent quality control measures ensure that each board meets exact specifications.

6. Testing and Quality Assurance

We implement rigorous testing protocols, including AOI and ICT, to allow early detection of issues, minimizing the risk of failures.

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

Here is a table of common parameters for high - speed PCB boards:

Parameter Description
Number of Layers Up to 20 layers or(customizable)
Material Type Such as FR - 4, Rogers RT/duroid series
Minimum Hole Size Typically 0.2mm - 0.4mm
Line Width/Spacing Usually 0.1mm - 0.3mm
Dielectric Constant Varies by material, e.g., 3.0 - 4.5
Dissipation Factor Generally 0.01 - 0.05
Copper Thickness Common values are 1oz, 2oz
Board Thickness Usually 1.0mm - 2.0mm
Surface Finish HASL, ENIG, etc.

5.Applications of High speed PCBs

High - speed PCBs are widely used in various high - tech fields, including telecommunications, computer systems, aerospace, and defense, where the reliable and efficient transmission of high - speed signals is essential for the proper functioning of the electronic devices.

At Ring PCB, we don’t just manufacture products—we deliver innovation. With all kinds of PCB Boards, combined with our PCB, PCB Assembly, and turn-key services, we empower your projects to thrive. Whether you need prototyping or mass production, our expert team ensures top-quality results.

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

17 Years of Excellence | Self-Owned Factory | End-to-End Technical Support
Core Advantage
1: Advanced Engineering for Precision PCB Manufacturing
• High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronics.
• Smart Manufacturing: Self-owned facility equipped with LDI laser exposure, vacuum lamination, and flying probe testers, adhering to IPC-6012 Class 3 standards.

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

Core Advantage 2: Integrated PCBA Services | One-Stop Turnkey Solutions
✓ Full Assembly Support: PCB fabrication + component sourcing + SMT assembly + functional testing.
✓ DFM/DFA Optimization: Expert engineering team reduces design risks and BOM costs.
✓ Rigorous Quality Control: X-ray inspection, AOI testing, and 100% functional validation for zero-defect delivery.

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

Core Advantage 3: Self-Owned Factory with Full Supply Chain Control
✓ Vertical Integration: Raw material procurement, production, and testing fully managed in-house.
✓ Triple Quality Assurance : AOI + impedance testing + thermal cycling, defect rate <0.2% (industry average: <1%).
✓ Global Certifications: ISO9001, IATF16949 and RoHS compliance.

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

Ring PCB not only offers professional PCB manufacturing, but also offer PCBA assembly service, including component sourcing and SMT service with Samsung functional machine.
Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

One of our core strengths lies in our 8-stage lead-free reflow soldering and lead-free wave soldering capabilities at our Shenzhen factory. These advanced soldering processes ensure high-quality assembly while adhering to global environmental standards, such as ISO9001, IATF16949 ,RoHS compliance.

Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material


Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

Please note:

All products in our store are processing customized services, please be sure to contact our professional customer service before placing an order to confirm the product details.

All photos on this site are real. Due to changes in lighting, shooting Angle, and display resolution, the image you see may have some degree of chromatic aberration. Thank you for your understanding.

Ring PCB Technology Co.,Limited is a professional PCB manufacturer with 17 years of history in China.

Our products are updated and upgraded every year and we specialize in all kinds of PCB making and PCBA customization services, If you are interested in our products, please tell us your requirements, we will help you to provide professional solutions, please contact us on line or E-mail to us info@ringpcb.com, and we will provide you with one-on-one service from our professional sales team.

Thank you for your time.

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Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

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Brand Name :
Ring or support OEM
Model Number :
High Speed PCB(customizable)
Certification :
ISO9001, ISO14001, ISO13485, and IATF16949.
Place of Origin :
Shenzhen, China
MOQ :
1unit
Price :
negotiable
Contact Supplier
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Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material
Precise High Speed PCB Electronic Printed Circuit Board FR4 Polyimide Material

Ring PCB Technology Co.,Limited

Verified Supplier
1 Years
shenzhen
Since 2008
Business Type :
Manufacturer, Seller
Total Annual :
5000000-10000000
Employee Number :
500~600
Certification Level :
Verified Supplier
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