Specifications
Brand Name :
YDY
Model Number :
M-002
Certification :
ISO13485, IATF16949, ISO9001,IOS14001
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiable
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :
50000pcs/month
Delivery Time :
1-10 working days
Packaging Details :
Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
Service :
Multilayer Printed Circuit Board
Type :
Multilayer Printed Circuit Board Main Board Surface Laminar Circuit
Ionic Contamination :
<1.56ug/cm2(NaCl)
Peel Strength :
≥1.4N/mm
Drill Hole Diameter :
0.005"-0.255" (0.15mm~6.5mm)
Surface :
HASL Lf/Enig/OSP
CAM software :
Genesis, CAM350
Min. hole size :
0.15-0.2mm
Description

Multilayer Printed Circuit Board Main Board Surface Laminar Circuit ​

Shenzhen Yideyi Technology Co., Ltd is located in the beautiful scenery of Shenzhen city of Guangdong Province, it has modernized standard workshop of 9000 square meters, more than 500 employees, is a professional manufacturers of production of aluminum plate, single, double, multilayer printed circuit board and flexible circuit board.

We have a strong engineering team, high quality and efficient production and fast and global service in the industry are in a leading position, based on quality, service, efficiency and win-win, our processing products are widely used in computer, communication, auto parts products, medical equipment, precision instruments, aviation equipment, and other fields, we also provide the OEM service to customers in Europe and America, South Korea, Japan, Southeast Asia, the Middle East and Latin America. Companies adhering to thought of the “management of science and technology and creative enterprise”, continue develop new process and new products so that ahead of competition in the market. The perfect quality management system can provide a solid guarantee for us to produce high quality products. Our company can provide copy board, sample, mass production service, and provide the express production services for the customers and so on.

To produce a multi-layer PCB, alternating layers of epoxy-infused fiberglass sheet called prepreg and conductive core materials are laminated together under high temperature and pressure using a hydraulic press. The pressure and heat causes the prepreg to melt and join the layers together.

Our Advantages:

• Strict product liability, taking IPC-A-160 standard

• Engineering pretreatment before production

• Production process control (5Ms)

• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC

• 100% AOI inspection, including X-ray, 3D microscope and ICT

• High-voltage test, impedance control test

• Micro section, soldering capacity, thermal stress test, shocking test

• In-house PCB production

• No minimum order quantity and free sample

• Focus on low to medium volume production

• Quick and on-time delivery

SMT Production processes:

Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

PCB Assembly Manufacturing Procedures:

Program Management

PCB Files → DCC → Program Organizing → Optimization → Checking

SMT Management

PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping

PCBA Management

THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment

Our service

1. SMT service;

2. Design service, Gerber drawings;

3. Good quality and fast delivery with lower price than double side PCB.

4. Specifications of LEAD Free HASL 1 Layer / Single Side Rigid PCB/PCBA:

1) Base material: FR-1(94v0), FR-4, CEM-1,

2) Max Board size: 600*600mm

3) Board thickness: 0.2mm/0.6mm/0.8mm/1.2mm/1.6mm/3.2mm

4) Copper thickness: 0.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz

5) Special tech: BGA, PTH, Blind and buried vias

6) Profile: V-scoring, V-cutting, punching, etching, milling, routing

7) Surface treatment: HASL, OS, Immersion gold, gold plated (coating)

8) With best price to USA, South American, India, South Africa and Europe

9) Main market: USA, EGYPT, Europe, South American, mid-east

10) Compliant: UL, ROHS, ISO9001-2000

11) Standard: IPC-A-600F, IPC-D-300G, MIL-STD-105D LEVEL II

12) Application: Home appliances, electronics, digital camera, LCD TV sets, medical equipments, telecommunication, LED lightings, street light, mobile phone, computer, laptop test equipment and power meter, electrical weighing scale, night

13) Small quantity and prototypes acceptable

14) Lead time: 5-7days for prototypes, 9-13days for mass production

15) Available Service: OEM, 24hrs service for fast prototype

Files Requested For Quote:

In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information:

1. Gerber file,PCB file,Eagle file or CAD file are all acceptable

2. A detailed bill of materials (BOM)

3. Clear pictures of PCB or PCBA sample for us

4. Quantity and delivery required

5. Test method for PCBA to guarantee 100% good quality products.

6. Schematics file for PCB design if need to do function test.

7. A sample if available for better sourcing

8. CAD files for enclosure manufacturing if required

9. A complete wiring and assembly drawing showing any special assembly instructions if required

Process Item Mass production capability
SMT Printing Max PCB size 900*600mm²
Max PCB weight 8kg
Solder paste printing tolerance ±25μm(6σ)
System repeat calibration tolerance ±10μm(6σ)
Scraper pressure detection pressure closed-loop control system
SPI Detect Min BGA PAD to PAD distance 100μm
x-axis and Y-axis tolerance 0.5μm
False Rate ≤0.1%
Mount Component size 0.3*0.15 mm²--200*125 mm²
Component max height 25.4mm
BGA/CSP Min PAD spacing, and Min PAD diameter 0.30mm,0.15mm
Populate tolerance ±22μm(3σ),±0.05°(3σ)
PCB board size 50*50 mm²-850*560 mm²
PCB thickness 0.3mm--6mm
Populate Max components type 500
AOI Detect Min components 01005
Detect false type Incorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball
Foot warping detection 3D Detection function
Reflow Temperature Accuracy ±1ºC
Welding protection nitrogen protection;(remaining oxygen<3000ppm)
Nitrogen Control Nitrogen closed-loop control system,±200ppm
3D X-Ray Magnification Geometric Magnification;:2000 times;System Magnification:12000times
Resolution 1μm /nm
Rotation Angle &Slanting Perspective Any ±45°+360°rotation
DIP Preelaboration Automatic forming technology Component Automatic forming
DIP DIP technology Automatic Insertion machine
Wave soldering Wave soldering type Ordinary wave soldering
Inclination angle of transport guide rail 4--7°
Temperature accuracy ±3ºC
Soldering protection nitrogen protection
Non-welding pressure contact technology Max PCB board size 800*600mm²
Press down height accuracy ±0.02mm
Pressure Range 0-50KN
Pressure Accuracy Standard value:±2%
Hold time 0-9.999S
Conformal coating technology Max PCB board size 500*475*6mm
Max PCB board weight 5kg
Min Nozzle size 2mm
Other characteristic Conformal coating pressure Programmable control
ICT test test level Device level test,Test hardware connection status.
Test point >4096
Test content Contact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test.
Assembly and test Production type TouchPad Mass production
TWS Mass production
Gaming controller Mass production
Life Watch Mass production
FT test test level PCB board system level test.Test System function status.
Temperature cycling test Temperature range -60ºC--125ºC
Rise/lower temperature rate >10ºC/min
Temperature tolerance ≤2ºC
Other Reliability test burn-in test,Drop test, vibration test , Abrasion test ,Key life test.

0.4 Mm 8 Layer Multilayer Printed Circuit Board Mainboard Surface Laminar Circuit

0.4 Mm 8 Layer Multilayer Printed Circuit Board Mainboard Surface Laminar Circuit

Trade Terms:

1. Payment: T/T in advance (Western Union , paypal is welcomed)

2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.

3. Sample can be delivered in 3days

4. Shipping freight are quoted under your requests

5. Shipping port: Shen zhen,Mainland China

6. Discounts are offered based on order quantities

7. MOQ: 1PCS

Package &Shipping Methods:

1. Vacuum package with silica gel, Carton box with packing belt.

2. By DHL, UPS, FedEx, TNT

3. By EMS

4. By sea for mass quantity according to customer's requirement

We are the smart choice for you and the trusted source at the center of your deal. Welcome the win-win situation together.

0.4 Mm 8 Layer Multilayer Printed Circuit Board Mainboard Surface Laminar Circuit

FAQ:

Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.

Q2. What file formats do you accept for production?

Gerber file: CAM350 RS274X

PCB file: Protel 99SE, P-CAD 2001 PCB

BOM: Excel (PDF,word,txt)


Q3. Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:Surface finish:
Solder mask color:
Silkscreen color:

Q4. How to make sure the PCBAs are completely well recieved?
We will pack with aluminum bag, and insert card, up and bottom card with stable cartons.

Q5. How to ship the PCBAs?
For small packages, we will ship the boards to you by DHL,UPS,FEDEX,TNT. Door to door service! For mass production, we could ship by air, by sea.

Q6. How to make sure the function is fine?
We could make sample/prototype and do functional testing before mass production.

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0.4 Mm 8 Layer Multilayer Printed Circuit Board Mainboard Surface Laminar Circuit

Ask Latest Price
Brand Name :
YDY
Model Number :
M-002
Certification :
ISO13485, IATF16949, ISO9001,IOS14001
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiable
Contact Supplier
0.4 Mm 8 Layer Multilayer Printed Circuit Board Mainboard Surface Laminar Circuit
0.4 Mm 8 Layer Multilayer Printed Circuit Board Mainboard Surface Laminar Circuit
0.4 Mm 8 Layer Multilayer Printed Circuit Board Mainboard Surface Laminar Circuit

Shenzhen Yideyi Technology Limited Company

Active Member
5 Years
shenzhen
Since 2018
Business Type :
Manufacturer
Total Annual :
5500,000-8000,000
Employee Number :
400~500
Certification Level :
Active Member
Contact Supplier
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