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2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly
Specifications
Brand Name :
YDY
Model Number :
P-013
Certification :
ISO13485, IATF16949, ISO9001
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiatable
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :
100000/month
Delivery Time :
1-5 working days
Packaging Details :
Anti-static bag + white pearl cotton (used around the inside of the carton) + carton
Name :
1-18Layers High Speed Digital Electronics PCB Design Single/Double PCBA
Min. line width :
0.1 0mm
Surface finishing :
ENIG,OSP
Copper thickness :
1~2oz
Item :
DGW-1
Application :
prototype PCB
Color :
Green/Blue/Red/White/Yellow/Black
Base material :
Copper Core
Description

1-18Layers High Speed Digital Electronics PCB Design Single/Double PCBA

We provide one-stop PCB/PCBA customization services:

1. To offer good quality PCB/PCBA to our customer, we will do many kind of testing to ensure quality before shipment
2. Outgoing test to check min PTH Cu thickness, Min surface Cu thickness, ENIG Au data,Ni data, Au layer adhesion testing, soldermask adhesion testing, silkscreen adhesion testing, Thermal stress testing, hardness testing, Twist testing, Bow testing
3. Microsection testing to check hole Cu thickness, Surface Copper thickness, Wrap copper thickness, Hole Wall Integrity, soldermask thickness and stack up.
4. E-test to check any open/short circuit.
5. Thermal Stress Test to avoid any Delamination, Measling and others.
6. Solderability of PTH to avoid any discolor, Wrinkles, Blisters, Measling, Blow-Hole, Solermask peel off, and soldermask filled in hole-wall incompletely.

PCB capability:

Item Specification
1 Numbr of Layer 1-18Layers
2 Material FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
3 Surface Finish HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
4 Finish Board Thickness 0.2mm-6.00 mm(8mil-126mil)
5 Copper Thickness 1/2 oz min;12 oz max
6 Solder Mask Green/Black/White/Red/Blue/Yellow
7 Min.Trace Width & Line Spacing 0.075mm/0.1mm(3mil/4mil)
8 Min.Hole Diameter for CNC Driling 0.1mm(4mil)
9 Min.Hole Diameter for punching 0.9mm(35mil)
10 Biggest panel size 610mm*508mm
11 Hole Positon +/-0.075mm(3mil) CNC Driling
12 Conductor Width(W)

0.05mm(2mil)or;

+/-20% of original artwork
13 Hole Diameter(H)

PTH L:+/-0.075mm(3mil);

Non-PTH L:+/-0.05mm(2mil)
14 Outline Tolerance

0.125mm(5mil) CNC Routing;

+/-0.15mm(6mil) by Punching
15 Warp & Twist 0.70%
16 Insulation Resistance 10Kohm-20Mohm
17 Conductivity <50ohm
18 Test Voltage 10-300V
19 Panel Size 110×100mm(min);660×600mm(max)
20 Layer-layer misregistration

4 layers:0.15mm(6mil)max;

6 layers:0.25mm(10mil)max
21 Min.spacing between hole edge to circuity pqttern of an inner layer 0.25mm(10mil)
22 Min.spacing between board oulineto circuitry pattern of an inner layer 0.25mm(10mil)
23 Board thickness tolerance

4 layers:+/-0.13mm(5mil);

6 layers:+/-0.15mm(6mil)
24 Impedance Control +/-10%
25 Different Impendance +-/10%


We form close working relationships between Electronics Engineers, Designers, Bare Board Manufacturers, and together with our own in house Test and Assembly facilities. Identify problem areas before they become an issue. Make recommendations that could possibly increase manufacturing or assembly yields on volume product.This approach shortens the design cycle, reducing the time to market, which in turn reduces the overall cost of a project, leading to a more cost effective product.

2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly

If you don't have a circuit or any PCB data. We can reverse engineer most bare PCB’s and provide you with up to date schematic diagrams and PCB design data.

2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly

Shenzhen Yideyi Technology Co., Ltd is an advanced technology company specialized in researching & developing, designing and manufacturing all types of intelligent control panels and controllers. We implement electronic product designs, industrial system automation designs, electronic circuit hardware and software designs and others while fulfilling OEM/ODM purchase orders. Our main focus is on R&D and technically-driven electronics manufacturing services (EMS).


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Product tags

single layer pcb assembly

,

single layer pcb design software

,

double layer pcb manufacturing
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2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly

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Product Detail
Brand Name :
YDY
Model Number :
P-013
Certification :
ISO13485, IATF16949, ISO9001
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiatable
Contact Supplier
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly

Shenzhen Yideyi Technology Limited Company

Active Member
5 Years
shenzhen
Since 2018
Business Type :
Manufacturer
Main Products :
Turnkey PCB Assembly, PCB Assembly Service, PCB Prototype Assembly
Total Annual :
5500,000-8000,000
Employee Number :
400~500
Certification Level :
Active Member
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