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Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
Specifications
Brand Name :
YDY
Model Number :
B-012
Certification :
ISO13485, IATF16949, ISO9001
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiate
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :
30000/month
Delivery Time :
5-8 working days
Packaging Details :
Anti-static bag + white pearl cotton (used around the inside of the carton) + carton
Name :
BGA Placement Complete Unit Assembly Box Build Assembly Fine-Pitch Component
Type :
Box Build Assembly
Base Material :
FR4/ROGERS/Aluminum/High TG
Surface Finishing :
Immersion Gold/Au, HASL, OSP
Copper Thickness :
0.5oz-6oz
Board Thickness :
0.1 to 6.0mm(4 to 240mil)
Min. Hole Size :
0.1mm
Testing :
E-test, Fly probe test
Description

BGA Placement Complete Unit Assembly Box Build Assembly Fine-Pitch Component​

Our capacity and service:

1. PCB fabrication from 1-32 layer. (single side, double side, multi-layer, HDI board, bury& blind holes board etc)
2. Material procurement and management
3. Quick-turn PCBA Prototype and NPI (new product introduction)
4. PCBA and through hole assembly
5. Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)
6. Small volume is accepted and High-mix models solutions
7. AOI, In circuit test, BGA placement, Function testing
8. Engineering support including end of life and obsolete component replacement and design support for circuit, metal,plastic casing and packaging

PCB production capacity

PCB'A Manufacturing capabilities
PCB board material type
Samples: 1-64 Layers, Mass production: 2-58 Layers, Flexible PCB: 1-12 Layers
Material
CEM-1,FR4,ALU,CEM-3,Rogers,HDI,etcFR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI
Material, BT Material, PPO, PPE etc.
Surface finish
HASL, OSP, Immersion Silver, Immersion Gold, ENIG, ENEPIG, Immersion Tin
QC
X-ray, AOI Test, Functional Test
Specialty
IOT, Medical, Security, GPS tracker, PLC control, Automotive electronics
SERVICE
PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB development and design, PCB manufacturing from 1 to
64 layers
Sanforized
Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back
drill, impedance control.
SMT Capabilities
components size
6mm-500mm
components max height
20mm

BOM (Bill of Material) for box level components (consign or turnkey):

3D CAD box assembly drawing
Circuit diagrams (Electrical systems schematics)
Test procedure and estimated time
Tooling and fixtures
Special testing equipment
Size and weight of the unit
Detailed build instructions
Sample unit if available
Testing: basic electrical safety testing, functionality testing
Acceptance Criteria
Any other special instructions
Shenzhen Yideyi Technology Co., Ltd is a professional and reliable one-stop PCB solutions provider for customers specialized in manufacturing quick turn prototypes and small volumes. With high quality and on-time delivery products we won the market′s wide acclaim. We will continue to focus on customer satisfaction, along with "high quality "and "fast delivery", we will become a PCB service provider worthy of customer trust.
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
We have built including medical device equipments, optical networking products, military portable server, smart home,WiMax wireless router, electric vehicle car charging station, etc.
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
FAQ:

Q1. What is needed for quotation

PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
PCBA: PCB information, BOM, (Testing documents...)
Full assembly product: PCBA Information and product buidinformation

Q2: With a variety of different product introduction experience, we have established a team of perfect

ISO9001 quality system certification, including: human resources, marketing department, project

management, engineering technology, PMC procurement, quality management, production, warehouse management And many other departments.

Q3. Are my files safe?
Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.

Q4; What is the delivery time?

Normal: 5-7 workingdays for samples, 7-25working days for bulk production.
For Urgent project: We can arrange preferential processing and control the delivery time as you request

Q5. Do you have MOQ?
There is no MOQ.We are able to handle Small as well as large volume production with flexibility.

Q6. How long have you been in business?
We have been supplying printed circuit boards since 2008

Product tags

low volume pcb assembly

,

low volume pcb manufacture

,

pcb manufacturing assembly
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Box Build Manufacturing Fine Pitch Component Low Volume PCB Production

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Product Detail
Brand Name :
YDY
Model Number :
B-012
Certification :
ISO13485, IATF16949, ISO9001
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiate
Contact Supplier
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production
Box Build Manufacturing Fine Pitch Component Low Volume PCB Production

Shenzhen Yideyi Technology Limited Company

Active Member
5 Years
shenzhen
Since 2018
Business Type :
Manufacturer
Main Products :
Turnkey PCB Assembly, PCB Assembly Service, PCB Prototype Assembly
Total Annual :
5500,000-8000,000
Employee Number :
400~500
Certification Level :
Active Member
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