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Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
Specifications
Brand Name :
YDY
Model Number :
B-005
Certification :
ISO13485, IATF16949, ISO9001
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiate
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :
30000/month
Delivery Time :
5-8 working days
Packaging Details :
Anti-static bag + white pearl cotton (used around the inside of the carton) + carton
Name :
Thick Film Circuit Rigid Multilayer Printed Board Box Build Assembly
Testing Service :
ICT,FCT,X-ray,AOI
Type :
Box Build Assembly
Board Thickness :
1.6mm
Base Material :
FR4/ROGERS/Aluminum/High TG
Min. Line Width :
3mil
Description

Thick Film Circuit Rigid Multilayer Printed Board Box Build Assembly

Shenzhen Yideyi Technology Co., Ltd manufacture PCBA/PCB for our customers,We specialize in electronics manufacturing, including electronic design and engineering, PCB fabrication, SMT and PCB assembly, components sourcing, prototyping, box build, mechanical & electrical engineering, testing, low, medium and high - volume production.

And these products are applied extensively to various fields: Computer, Communication, Consumer electronics, Industrial Controller, Smart living, Wearable device, Automobile Electronics.


Our PCB solutions include the following components of box build assembly:

Product assembly
System-level assembly
Sub-level product assembly
Packaging and labeling
Testing
Software loading and product configuration
Aftermarket service
Warehousing and traceability

PCB production capacity


PCB layers 1 to 48 layers
PCB board material type CEM-1,FR4,High-TG FR4,ALU,CEM-3,Rogers,HDI,etc.
Max dimension 600 x 480mm
Min line width 0.1mm
Min spacing 0.1mm
Dimension tolerance ±0.1mm
Min hole diameter 0.2mm
Pcb board thickness coverage 0.2 to 6.0mm
Min copper thickness in hole 0.02mm
DK thickness 0.08 to 6.0mm
NPTH size tolerance ±0.025mm
PTH size tolerance ±0.025mm
Dimension tolerance ±0.1mm
Laser drill hole size 0.1mm
Min soler mask 0.01mm
Minimum size of solder mask separation ring 0.05mm
Max board twist and wrap ≤1%
Finished hole diameter 0.2 to 6.0mm
Flame resistance 94V-0
Impedance control tolerance ±5%
Outer layer copper thickness 8.75 to 175um
Inner layer copper thickness 17.5 to 175um
Solder mask type Blue,Green,Black,Yellow,Red,White
Surface finish ENIG, Gold plating,Immersion silver,Immersion tin,etc.
Certificate ISO9001, ISO14001, ISO14969

We are an electronic box building manufacturer, we provide a full electrical and mechanical box build assembly service tailor made to your unique requirements. We offer sub-system and complete box/system assembly services.

We are well equipped and experienced in providing a total turnkey manufacturing solution for highly complex and configurable box build requirements. We are flexible to accept turnkey, consignment, and hybrid material solutions per customer requirements.

Whatever volume you want to build, we provide OEM customers with complete box build services, with build-to-order (BTO), configurate-to-order(CTO), software configurations, loading, final test to specifications.

Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film

Our quality control advantage lies in the strict implementation of the entire process control system.

Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
FAQ:

Q1. What is needed for quotation

PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
PCBA: PCB information, BOM, (Testing documents...)
Full assembly product: PCBA Information and product buidinformation

Q2: With a variety of different product introduction experience, we have established a team of perfect

ISO9001 quality system certification, including: human resources, marketing department, project

management, engineering technology, PMC procurement, quality management, production, warehouse management And many other departments.

Q3. Are my files safe?
Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.

Q4; What is the delivery time?

Normal: 5-7 workingdays for samples, 7-25working days for bulk production.
For Urgent project: We can arrange preferential processing and control the delivery time as you request

Q5. Do you have MOQ?
There is no MOQ.We are able to handle Small as well as large volume production with flexibility.

Q6: What is the payment term?
100%T/T in advance normally;50% deposit,50% balance by T/T before shipment

Product tags

multilayer pcb manufacturing

,

pcb multilayer fabrication

,

pcb multilayer manufacturing process
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Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film

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Product Detail
Brand Name :
YDY
Model Number :
B-005
Certification :
ISO13485, IATF16949, ISO9001
Place of Origin :
China
MOQ :
1pcs
Price :
Negotiate
Contact Supplier
Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film
Rigid Multilayer Printed Circuit Board Manufacturing Process Thick Film

Shenzhen Yideyi Technology Limited Company

Active Member
5 Years
shenzhen
Since 2018
Business Type :
Manufacturer
Main Products :
Turnkey PCB Assembly, PCB Assembly Service, PCB Prototype Assembly
Total Annual :
5500,000-8000,000
Employee Number :
400~500
Certification Level :
Active Member
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